Industrial Laser Solutions
Highly Precise and Proven
Our industrial laser solutions enable precise, material‑friendly and cost‑effective processing of a wide range of materials. From PCB materials such as FR4 and polyimide to metals including aluminum, stainless steel, titanium and copper, as well as ceramics and c‑Si solar cells, we develop tailored laser processes for demanding industrial applications.
The portfolio ranges from energy‑efficient laser drying of pastes to precise laser depaneling and laser cutting of printed circuit boards, IMS and ceramic substrates, followed by laser marking for traceability and smart‑factory applications. It is complemented by high‑accuracy laser welding processes, selective laser cleaning of functional surfaces, laser soldering for temperature‑sensitive components, and micro machining solutions for micro‑scale material processing. All laser systems are modular in design and can be flexibly configured to match material, process requirements and automation levels.
Laser Drying
Laser Depaneling
Laser Depaneling
Thanks to laser technology, rigid and flexible PCBs can be separated precisely, stress-free and particle-free, with an accuracy of ±25 µm. The machines meet the standards for technical cleanliness in accordance with VDA 19 and ISO 16232 and maximize the degree of utilization of the PCBs.
Process reliability and precision are further enhanced by OPTICUT technology, which delivers consistently high cut quality and efficiency through optical focus tracking during laser depaneling, as well as the integrated ON-AXIS Camera for accurate positioning and fiducial recognition.
Laser Cutting
Laser Cutting
Reliable, low-maintenance fiber lasers and precision cutting heads on CNC axes are used for laser cutting of IMS and ceramic substrates. High accuracy is achieved with the help of an on-axis camera and industrial image processing. Cutting gases adapted to the process and an extraction system ensure technical cleanliness.
Laser Marking
Laser Marking
Tailor-made solutions for the direct marking of metal, plastic and ceramic are at the heart of our range. This also includes high-precision UDI markings for ceramic and metal implants using USP lasers (“black marking”).
The INSIGNUM product line also offers a comprehensive traceability solution for the smart factory. For laser direct marking of electronic circuit carriers (FR4), CO₂ lasers are used for color change and fiber lasers for solder resist removal.
For customer-specific requirements, we enable flexible product positioning using 6-axis robots and MOTF (Marking On The Fly).
Laser Welding
Laser Welding
Current developments focus on the hermetically sealed welding of camera housings in autonomous and semi-autonomous vehicles using CNC welding heads and multi-KW fiber lasers. Optical coherence tomography (OCT) is used for process and quality control. It is also possible to integrate laser plastic welding processes into final assembly solutions. Another key topic is the laser welding of metallic bipolar plates for fuel cells.
Laser Cleaning
Laser Cleaning
Laser cleaning of surfaces is ideal for applications that require precise, localized control. This includes the surface pre-treatment of sealing and bonding surfaces on die-cast aluminum and injection-molded plastic as well as the selective removal of flux residues on bonding surfaces. Electronics that have already been mounted remain undamaged.
Process reliability is further enhanced by the integrated ON-AXIS Camera for precise positioning and component recognition, as well as OPTICUT technology with optical focus tracking for consistently high processing quality.
Laser Soldering
Micro Machining
Micro Machining
Customized solutions for micro material processing, such as scribing, ablation or drilling of metal, silicon and ceramics. Depending on the process, different levels of automation and beam sources are used. For example, a USP laser (ultrashort pulse) is used for scribing DCB master cards (direct copper bonded substrates) and cutting solid-state battery substrates to achieve the highest quality.
Precision up to 10 µmDigital laser control, image processing and precision engineering enable maximum accuracy.
Simple OperationThe SIMPLEX interface facilitates familiarization and minimizes operating errors.
Many Years Of ExperienceOur experts realize your requirements with laser machines and process qualification in the laser laboratory.
Modular Approach
The POLYPHOS modular principle enables flexible laser processes for current and future requirements by combining modules for beam steering, beam sources, housings and transport with automation options.
- Technologies for Maximum Precision: Fully digital beam deflection, laser power measurement, calibration and extraction systems ensure precise results and maximum safety.
- Seamless Integration into the Smart Factory: With monitoring, calibration and preventive maintenance, the systems integrate seamlessly into digital production environments.
Why POLYPHOS?
- Maximum precision in material processing
- Individually configurable laser systems
- Focus on sustainable and future-oriented technologies
- Comprehensive expertise in laser technology for industrial applications
Sustainable technologies for the future
With innovative manufacturing solutions for fuel cells and batteries, POLYPHOS supports the transformation from fossil fuels to hydrogen technologies. The machine solutions are ideally suited for the production of drive components in e-mobility.
Software Platform SynapticaOS
Plan. Control. Monitor. – One Platform. All Levels.
SynapticaOS offers intuitive and easy-to-implement software for industry.
The software platform optimizes processes through seamless data availability and
combines MES functionality with solutions for real-time monitoring of material logistics and production.
