Operating with Highest Precision
POLYPHOS DP laser depaneling machines can cut flexible and rigid PCBs with a thickness of 0.1mm to 1.6mm. Due to the non-contact operation of the laser, holding forces are not necessary. Complex structures are lasered with the highest accuracy. Thus, benefits with higher packing density are possible. In addition, the particles produced are significantly smaller and can be easily extracted due to their nature as airborne particles. To ensure that none of these particles are inhaled by the operator, a three-stage extraction and filter system with pre-filter is installed. The filter unit is monitored in the same way as the extraction volume flow in the machine itself.
Our Highlights:
The Solution
Increasing miniaturization and the associated increased packing density requires a highly precise and low-stress solution for cutting out PCBs.
Life Science
Flexible PCBs are increasingly on demand in medical electronics. They are used in sensors or pacemakers, as they allow a wide range of geometries. For these circuits, in addition to precision, it is important to generate as few particles as possible during the separation process in order to avoid malfunctions. Thanks to the laser separation process from ASYS, this can be realized.
Automotive
In addition to nearly dust-free separation, high throughput and traceability also play a role in the automotive industry. With our flexible production concept, a production line can easily be scaled for different throughput requirements with full traceability.
Material Testing
Would you like to know whether your material is suitable for laser depaneling? Or are you looking for the optimal laser settings? Send us your material for a free application test. Contact your sales contact person.